Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by Madhav Datta, Takayuki Ohba, Tetsuya Osaka, Yosi Shacham-Diamand

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications



Download Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications




Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications Madhav Datta, Takayuki Ohba, Tetsuya Osaka, Yosi Shacham-Diamand
Language: English
Page: 533
Format: pdf
ISBN: 0387958673, 9780387958675
Publisher: Springer

This book presents one of the new frontiers of modern electrochemistry science and technology: electrochemical processes for Ultra-large-Scale Integration (ULSI) technology for Integrated Circuits (ICs) applications. This is a field which influences our day to day life and still presents major technological and scientific challenges. This book reviews ULSI technology in light of all the novel electrochemical processes which make ULSI technology possible. The book will focus on sub-100 nm CMOS technology, mainly on copper-based metallization.

From the Back Cover

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors.

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